Posted by Tami Western on January 28, 2010 at 16:14:59:
Hi There,
Can anyone share their technique for cross-sectioning Integrated Circuits. I would specifically like to preserve the die metal features and passivation layers. The SiC polishing discs I am using seem to crack the die at this area. If I use Diamond Discs I get alot of particles stuck in the Solder balls. Any thoughts would be appreciated.